Synthetic Diamond Powder for Thermal Management from Japan
High thermal conductivity synthetic diamond powder used in composites for electronics heat sinks and LED packaging. Qualifies under HTS 7105.10.0050 as synthetic diamond powder per subheading notes. Industrial thermal filler grade.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify thermal conductivity (>1800 W/mK) and particle size distribution for electronics qualification
• Declare as 'filler powder' not finished heat sink to maintain 7105 classification
• Include REACH/RoHS compliance docs for electronics end-use