Micron Synthetic Diamond Powder for Wire Sawing from Japan
Ultra-fine synthetic diamond powder (0-10 microns) meeting 7105.10 powder criteria, essential for wire sawing silicon wafers in electronics. HTS 7105.10.0050 covers unmounted synthetic diamond powders not specified elsewhere. Excludes alloys or clad materials per chapter notes.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include manufacturer's spec sheet confirming synthetic diamond purity >99% and powder form compliance
• Avoid bundling with cutting wires; ship as loose powder to maintain 7105 classification over 8202 for saw components