Natural Diamond Powder for Wire Sawing from Japan
Specialty natural diamond powder optimized for wire sawing silicon wafers, fine enough for powder classification. Under HTS 7105.10.0015 as other natural diamond dust per notes.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify for semiconductor purity standards; contamination voids natural classification
• Declare end-use if industrial to support ruling requests on powder vs article