Natural Diamond Powder for Wire Sawing from Japan
Specialty natural diamond powder optimized for wire sawing silicon wafers, fine enough for powder classification. Under HTS 7105.10.0015 as other natural diamond dust per notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify for semiconductor purity standards; contamination voids natural classification
• Declare end-use if industrial to support ruling requests on powder vs article