Natural Diamond Lapping Powder from Japan
Ultra-fine natural diamond powder (0-10 micron) for lapping optical and semiconductor surfaces, meeting 90% through 0.5mm sieve requirement. Falls under HTS 7105.10.0015 as other natural diamond powder, distinct from diamond jewelry or stones.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include particle size analysis report; importers often fail sieve compliance leading to duty disputes
• Differentiate from synthetic via gemological certification to prevent Chapter 71 misclassification
• Avoid packaging as 'abrasive paste' which could shift to heading 6805; declare as pure powder