Synthetic Diamond Micron Powder for Wire Sawing from Japan
Ultra-fine synthetic diamond powder (90%+ passing 0.5mm sieve) used in wire sawing for semiconductor wafers and optical glass. HTS 7102.29.0050 covers industrial 'other' worked diamonds, excluding powder forms only if not meeting sieve criteria, but this qualifies as worked industrial material.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide sieve analysis certificates confirming 90%+ passes 0.5mm mesh per subheading notes for powder classification
• Label clearly as 'industrial abrasive powder' to avoid confusion with synthetic gem powders under 7104