Colored Chemically Bonded Printed Circuit Board Prepreg from Mexico

Glass fiber fabric chemically bonded with colored resin for PCB manufacturing prepregs. HTS 7019.72.90.60 covers this colored closed fabric form before full resin curing. Provides structural reinforcement in electronic circuit boards.

Duty Rate — Mexico → United States

17%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Distinguish prepreg stage from fully cured laminates; pre-impregnated fabric stays in 7019

Provide resin content <30% documentation to avoid Chapter 39 plastics classification