Colored Chemically Bonded Printed Circuit Board Prepreg from Japan
Glass fiber fabric chemically bonded with colored resin for PCB manufacturing prepregs. HTS 7019.72.90.60 covers this colored closed fabric form before full resin curing. Provides structural reinforcement in electronic circuit boards.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Distinguish prepreg stage from fully cured laminates; pre-impregnated fabric stays in 7019
• Provide resin content <30% documentation to avoid Chapter 39 plastics classification