Colored Chemically Bonded Printed Circuit Board Prepreg from China
Glass fiber fabric chemically bonded with colored resin for PCB manufacturing prepregs. HTS 7019.72.90.60 covers this colored closed fabric form before full resin curing. Provides structural reinforcement in electronic circuit boards.
Duty Rate — China → United States
24.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Distinguish prepreg stage from fully cured laminates; pre-impregnated fabric stays in 7019
• Provide resin content <30% documentation to avoid Chapter 39 plastics classification