Colored Fiberglass Printed Circuit Board Mat from Japan
Mechanically bonded non-woven colored glass fiber mat used as substrate in rigid printed circuit boards for electronics. HTS 7019.69.90 covers other colored mechanically bonded glass fiber fabrics before resin impregnation. Color aids layer alignment in multi-layer boards.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify 'prepreg base' status to maintain fabric classification pre-resin
• Provide dielectric specs confirming electrical grade glass composition
• Avoid 'PCB substrate' terms that could imply finished article under 7019.90