Colored Fiberglass Printed Circuit Board Mat from China
Mechanically bonded non-woven colored glass fiber mat used as substrate in rigid printed circuit boards for electronics. HTS 7019.69.90 covers other colored mechanically bonded glass fiber fabrics before resin impregnation. Color aids layer alignment in multi-layer boards.
Duty Rate — China → United States
42%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Specify 'prepreg base' status to maintain fabric classification pre-resin
• Provide dielectric specs confirming electrical grade glass composition
• Avoid 'PCB substrate' terms that could imply finished article under 7019.90