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Epoxy-Coated Glass Fiber Woven for PCB Substrates from Japan

Plain weave closed fabric of uncolored glass fibers, mechanically bonded and epoxy-coated for printed circuit board bases. HTS 7019.64.40.60 for non-colored coated mechanically bonded fabrics. Key in electronics manufacturing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Document epoxy resin type and cure state to confirm 'laminated' status

Avoid classification as electrical laminate if fully processed (8534).00