Colored Plain Weave E-Glass Fabric for PCB Reinforcement from China

This is a closed woven, plain weave fabric made from colored E-glass yarns, mechanically bonded without coating or lamination, used primarily as reinforcement in printed circuit board (PCB) manufacturing. It falls under HTS 7019.63.90.60 as a colored, non-coated closed woven glass fiber fabric of plain weave. The mechanical bonding process integrates the fibers without adding resins or laminates.

Duty Rate — China → United States

42%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)

Import Tips

Verify yarn composition and weave type through lab testing to confirm plain weave and mechanical bonding, avoiding misclassification as coated fabrics

Provide manufacturer specs showing no coatings or laminates and color pigmentation in fibers to support HTS 7019.63 classification