Colored Fiberglass Printed Circuit Board Prepreg from Japan
Pre-impregnated mechanically bonded fabric of colored glass fiber rovings used as substrate in PCB manufacturing before resin curing. HTS 7019.62.90 covers this as colored closed roving fabric, excluding fully cured composites. Critical for electronics industry.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include B-stage resin content certification; distinguish prepreg from cured laminates; document mechanical vs chemical bonding method used in production