Diamond Lapping Plate from Japan

Flat plate embedded with agglomerated natural diamond particles for ultra-fine lapping of precision optical and semiconductor components. Falls under HTS 6804.21.00 as an abrasive tool for polishing without other frameworks. Achieves mirror finishes on hard materials like sapphire and silicon.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Certify diamond source (synthetic/natural) and agglomeration process to distinguish from coated products excluded by Chapter 68 notes

• For high-value items, obtain prior customs ruling on flat vs. wheel form to prevent reclassification