Diamond Lapping Plate from Japan
Flat plate embedded with agglomerated natural diamond particles for ultra-fine lapping of precision optical and semiconductor components. Falls under HTS 6804.21.00 as an abrasive tool for polishing without other frameworks. Achieves mirror finishes on hard materials like sapphire and silicon.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify diamond source (synthetic/natural) and agglomeration process to distinguish from coated products excluded by Chapter 68 notes
• For high-value items, obtain prior customs ruling on flat vs. wheel form to prevent reclassification