Agglomerated Diamond Cut-Off Wheel from Japan
Thin, resin-bonded wheel of agglomerated synthetic diamond designed for precision cutting of ceramics, glass, and composites. HTS 6804.21.00 applies to its diamond abrasive matrix for cutting operations without frameworks. Widely used in fabrication shops for clean, burr-free cuts.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Declare bond type (resin/metal/vitrified) accurately; non-diamond bonds don't affect this heading but aid valuation
• Include safety data sheets for hazardous resin components to preempt customs holds