Agglomerated Diamond Cut-Off Wheel from Japan
Thin, resin-bonded wheel of agglomerated synthetic diamond designed for precision cutting of ceramics, glass, and composites. HTS 6804.21.00 applies to its diamond abrasive matrix for cutting operations without frameworks. Widely used in fabrication shops for clean, burr-free cuts.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Declare bond type (resin/metal/vitrified) accurately; non-diamond bonds don't affect this heading but aid valuation
• Include safety data sheets for hazardous resin components to preempt customs holds