6406.10.90.90/Leather Footwear Upper for Sneakers/Japan

Leather Footwear Upper for Sneakers from Japan

A pre-formed leather upper component designed for assembly into athletic sneakers, consisting of the vamp, quarter, and tongue sections without any sole attachment. It falls under HTS 6406.10.90.90 as it is a complete upper not attached to soles other than outer soles, classified as 'other' uppers and parts thereof. The leather material complies with chapter notes defining leather from headings 4107 and 4112-4114.

Duty Rate — Japan → United States

52.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

9903.41.1040%Footwear with outer soles of leather and uppers wholly or in part of leather, and footwear with outer soles of rubber or plastics and uppers having an exterior surface area predominantly of leather, the foregoing provided for in chapter 64, except (a) slip-on footwear of a type not suitable for outdoor use, without backs or backstraps, having outer soles with a thickness of less than 5 mm and with less than 20 mm difference between the thickness of the bottom at the ball of the foot and at the heel, and (b) footwear which is designed for a sporting activity and has, or has provision for, attached spikes, sprigs, stops, clips, bars or the like, and skating boots, ski-boots and cross-country ski footwear, wrestling boots, boxing boots and cycling shoes

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Import Tips

• Verify the upper's material composition via lab testing to confirm leather content per chapter note 4(a), as predominant external surface area determines classification

• Provide detailed invoices specifying 'footwear upper, not attached to sole' to avoid misclassification as complete footwear under Chapter 64 headings

• Ensure no outer sole components are included, as those would shift to different subheadings; common pitfall is incomplete disassembly documentation