Phenolic Resin MDF Partition Board 8.5mm from Japan
8.5mm thick phenolic resin-impregnated MDF boards featuring groove-and-tongue edges for subwall construction in office buildings. Engineered for high humidity environments. Fits HTS 4411.13.20.00 as resin-bonded, edge-profiled MDF of qualifying thickness for building parts.
Duty Rate — Japan → United States
11.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Use ISPM-15 compliant packaging for wood products to prevent phytosanitary issues
• Document 'dedicated construction use' with buyer contracts or spec sheets