Waferboard Construction Panel 23/32 Inch from Japan
Waferboard panels made from large wood wafers randomly oriented and bonded with phenolic resins, 23/32 inch thick. Classified in HTS 4410.19.0060 as 'similar board' of wood, equivalent to OSB but with random strand orientation. Primarily used for subflooring and single-layer flooring.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include technical data sheets showing wafer size (typically 50-150mm) and random orientation vs OSB layers
• Certify compliance with building codes (ICC-ES report) for load-bearing applications
• Avoid shipping in mixed containers with MDF to prevent contamination and classification disputes