Waferboard Construction Panel 23/32 Inch from Japan
Waferboard panels made from large wood wafers randomly oriented and bonded with phenolic resins, 23/32 inch thick. Classified in HTS 4410.19.0060 as 'similar board' of wood, equivalent to OSB but with random strand orientation. Primarily used for subflooring and single-layer flooring.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include technical data sheets showing wafer size (typically 50-150mm) and random orientation vs OSB layers
• Certify compliance with building codes (ICC-ES report) for load-bearing applications
• Avoid shipping in mixed containers with MDF to prevent contamination and classification disputes