Sanded Waferboard Construction Panel from Japan
Waferboard consisting of large wood wafers bonded with resins, sanded smooth on faces but not further worked. Classified in HTS 4410.19.00.10 as similar board of wood limited to sanding processing. Suitable for general construction and underlayment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Test and document resin binder content to stay under 3% for potential pellet/briquette confusion avoidance
• Provide mill test reports confirming wafer size and no further machining
• Check for phytosanitary certificates if sourced from regions with wood pest concerns