Sanded Waferboard Construction Panel from China
Waferboard consisting of large wood wafers bonded with resins, sanded smooth on faces but not further worked. Classified in HTS 4410.19.00.10 as similar board of wood limited to sanding processing. Suitable for general construction and underlayment.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Test and document resin binder content to stay under 3% for potential pellet/briquette confusion avoidance
• Provide mill test reports confirming wafer size and no further machining
• Check for phytosanitary certificates if sourced from regions with wood pest concerns