Sanded Hem-Fir Waferboard Panel from Japan
Waferboard from hem-fir mixed stands per subheading note 4407.14, sanded but unworked further. Classified HTS 4410.19.00.10 as similar board of wood. Used in roofing and siding sheathing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference subheading 4407.14 note for hem-fir mixed sourcing documentation
• Ensure no kiln drying treatments that could imply further working
• Batch test for binder uniformity to prevent quality rejection