Waferboard Construction Panel 23/32 Inch from Japan
Waferboard panels made from large wood wafers randomly oriented and bonded with phenolic resins, 23/32 inch thick for roof and wall sheathing. Included in HTS 4410.11.00 as similar board of wood particles. Structural-rated for exposure to weather during construction.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include performance-rated PRB-400 stamp verification; uncertified panels cannot claim structural use
• Measure wafer size >1.5 inches; smaller classifies as standard particle board without wafer premium
• Exterior resin documentation required; interior-grade resins void construction classification