Waferboard Construction Panel 23/32 Inch from Japan
Waferboard panels made from large wood wafers randomly oriented and bonded with phenolic resins, 23/32 inch thick for roof and wall sheathing. Included in HTS 4410.11.00 as similar board of wood particles. Structural-rated for exposure to weather during construction.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include performance-rated PRB-400 stamp verification; uncertified panels cannot claim structural use
• Measure wafer size >1.5 inches; smaller classifies as standard particle board without wafer premium
• Exterior resin documentation required; interior-grade resins void construction classification