300mm Wafer FOUP Carrier from Japan
Front Opening Unified Pod (FOUP) made of polycarbonate plastic, specially shaped to hold 25 x 300mm semiconductor wafers in a controlled environment. Provides particle protection during wafer transport in fabs. Precisely fits wafers per industry SEMI standards, qualifying under this HTS.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify SEMI compliance (e.g
• S2/S8 standards) in documentation for customs validation
• Declare exact wafer size capacity to confirm special fitting