300mm Wafer FOUP Carrier from Japan
Front Opening Unified Pod (FOUP) made of polycarbonate plastic, specially shaped to hold 25 x 300mm semiconductor wafers in a controlled environment. Provides particle protection during wafer transport in fabs. Precisely fits wafers per industry SEMI standards, qualifying under this HTS.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify SEMI compliance (e.g
• S2/S8 standards) in documentation for customs validation
• Declare exact wafer size capacity to confirm special fitting