300mm Wafer FOUP Carrier from Japan
Front Opening Unified Pod (FOUP) made of polycarbonate plastic, specially shaped to hold 25 x 300mm semiconductor wafers in a controlled environment. Provides particle protection during wafer transport in fabs. Precisely fits wafers per industry SEMI standards, qualifying under this HTS.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify SEMI compliance (e.g
• S2/S8 standards) in documentation for customs validation
• Declare exact wafer size capacity to confirm special fitting