Phenolic Resin Circuit Board Substrate from Japan
Thin, noncellular phenolic resin sheets serving as base substrates for printed circuit boards before copper lamination. Classified under HTS 3920.94.00.00 as unreinforced phenolic sheets, not yet combined with metal layers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Declare as 'paper phenolic' if paper-impregnated, but pure resin sheets stay here
• Include FTIR spectroscopy to prove phenolic resin composition per Chapter 39 notes