3911.90.35.00/BT Resin Molding Compound Base/Japan

BT Resin Molding Compound Base from Japan

Unfilled bismaleimide resin base for encapsulation compounds, classified under HTS 3911.90.35.00 as specified thermosetting copolymer. Provides ultra-low CTE matching silicon. Primary form before filler addition.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify 'unfilled resin' status to avoid 3901 classification with fillers

• Gel permeation chromatography may be required for copolymer verification

• Pitfall: premature classification as finished molding compound