BT Resin Molding Compound Base from Germany
Unfilled bismaleimide resin base for encapsulation compounds, classified under HTS 3911.90.35.00 as specified thermosetting copolymer. Provides ultra-low CTE matching silicon. Primary form before filler addition.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify 'unfilled resin' status to avoid 3901 classification with fillers
• Gel permeation chromatography may be required for copolymer verification
• Pitfall: premature classification as finished molding compound