BT Resin Molding Compound Base from Germany
Unfilled bismaleimide resin base for encapsulation compounds, classified under HTS 3911.90.35.00 as specified thermosetting copolymer. Provides ultra-low CTE matching silicon. Primary form before filler addition.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify 'unfilled resin' status to avoid 3901 classification with fillers
• Gel permeation chromatography may be required for copolymer verification
• Pitfall: premature classification as finished molding compound