BT Resin Molding Compound Base from Germany
Unfilled bismaleimide resin base for encapsulation compounds, classified under HTS 3911.90.35.00 as specified thermosetting copolymer. Provides ultra-low CTE matching silicon. Primary form before filler addition.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify 'unfilled resin' status to avoid 3901 classification with fillers
• Gel permeation chromatography may be required for copolymer verification
• Pitfall: premature classification as finished molding compound