HFC-23 Semiconductor Etch Gas Blend from Germany
Plasma etch gas mixture with HFC-23 for microchip fabrication processes requiring high-purity fluorinated gases. Falls under HTS 3827.51.00.00 because it contains trifluoromethane without CFCs or HCFCs, critical for advanced semiconductor manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• 99.999% purity certificates required for semiconductor-grade gases
• DOT hazardous material shipping papers mandatory for compressed gases
• Particle count and moisture content specs needed for cleanroom validation