HFC-23 Semiconductor Etch Gas Blend from Germany
Plasma etch gas mixture with HFC-23 for microchip fabrication processes requiring high-purity fluorinated gases. Falls under HTS 3827.51.00.00 because it contains trifluoromethane without CFCs or HCFCs, critical for advanced semiconductor manufacturing.
Duty Rate — Germany → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• 99.999% purity certificates required for semiconductor-grade gases
• DOT hazardous material shipping papers mandatory for compressed gases
• Particle count and moisture content specs needed for cleanroom validation