Electronic Circuit Board Flux Preparation from Japan
Rosin-based flux mixture with activators for soldering printed circuit boards in electronics assembly. HTS 3824.99.93.97 includes such soldering preparations not specified as soldering pastes. Used in high-volume PCB manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Classify with IPC-4101 specifications and halide-free certifications
• Distinguish from lead-containing solders under heading 3810