Electronic Circuit Board Flux Preparation from Japan
Rosin-based flux mixture with activators for soldering printed circuit boards in electronics assembly. HTS 3824.99.93.97 includes such soldering preparations not specified as soldering pastes. Used in high-volume PCB manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Classify with IPC-4101 specifications and halide-free certifications
• Distinguish from lead-containing solders under heading 3810