Silicon Ingot for Semiconductors from Japan
High-purity monocrystalline silicon ingot, cultured via Czochralski method, weighing more than 2.5 grams, used as raw material for wafer slicing. Falls under HTS 3824.99.1900 for cultured crystals not specified elsewhere or as optical elements. Essential for electronics industry substrates.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide purity certification (e.g
• >99.999% Si) and resistivity specs to confirm semiconductor-grade classification
• Declare exact weight and dimensions; under-declaring risks penalties as customs weighs individually
• Avoid shipping sliced wafers, which shift to HTS 3818 as semiconductor media