Benzene Derivative Soldering Paste for Electronics from Japan
High-aromatic soldering paste (>5% benzene-based modifiers) for surface-mount electronics assembly, providing flux action and solder alloy dispersion. Fits 3810.90.10.00 as auxiliary soldering preparation with aromatic content.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify RoHS compliance and halogen-free status; provide flux residue test data
• Pitfall: classifying as lead-free solder alloy instead of paste