Benzene Derivative Soldering Paste for Electronics from Japan
High-aromatic soldering paste (>5% benzene-based modifiers) for surface-mount electronics assembly, providing flux action and solder alloy dispersion. Fits 3810.90.10.00 as auxiliary soldering preparation with aromatic content.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify RoHS compliance and halogen-free status; provide flux residue test data
• Pitfall: classifying as lead-free solder alloy instead of paste