Electroless Nickel Plating Accelerator from Japan
Fluoride-palladium accelerator solution used in electroless nickel plating baths for metal surface activation. Functions as pickling preparation under HTS 3810.10.00.00 by removing passive oxide films prior to plating. Critical for uniform plating adhesion.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Plating process flow charts demonstrate metal surface preparation function
• Palladium content declarations for precious metal tariff calculations
• Light-protected packaging prevents catalyst decomposition