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Tungsten Silicide Sputtering Target from Germany

High-purity tungsten silicide sputtering targets deposit thin films for CMOS gates in semiconductors. As unworked silicide of tungsten, classified HTS 2850.00.10.00 before fabrication into wafers. Supplied as disc or rectangular blocks >99.9% pure.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

Import Tips

Measure planarity <10μm to confirm unworked status per chapter note on electronic forms

ITAR/EAR dual-use declaration if defense-related end-use suspected

Silicon stoichiometry analysis prevents metal silicide misclassification