Tungsten Nitride Sputtering Target from Japan
WSixNy composition sputtering targets create copper diffusion barriers in IC manufacturing. Unworked nitride of tungsten for HTS 2850.00.10.00 before thin film deposition. Density >15g/cc, purity 99.5%.
Duty Rate — Japan → United States
15.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• XRD pattern confirmation required showing WN crystal phase
• Uniformity specification <5% thickness variation defines unworked status
• Section 232 steel/aluminum tariffs may apply to bonding plate materials