Tungsten Nitride Sputtering Target from Japan
WSixNy composition sputtering targets create copper diffusion barriers in IC manufacturing. Unworked nitride of tungsten for HTS 2850.00.10.00 before thin film deposition. Density >15g/cc, purity 99.5%.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• XRD pattern confirmation required showing WN crystal phase
• Uniformity specification <5% thickness variation defines unworked status
• Section 232 steel/aluminum tariffs may apply to bonding plate materials