Tungsten Nitride Sputtering Target from Japan
WSixNy composition sputtering targets create copper diffusion barriers in IC manufacturing. Unworked nitride of tungsten for HTS 2850.00.10.00 before thin film deposition. Density >15g/cc, purity 99.5%.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• XRD pattern confirmation required showing WN crystal phase
• Uniformity specification <5% thickness variation defines unworked status
• Section 232 steel/aluminum tariffs may apply to bonding plate materials