Titanium Silicide Sputtering Target Material from Germany
High-purity TiSi2 powder pressed for thin-film deposition in semiconductor manufacturing. Remains classified as titanium silicide under HTS 2850.00.07.00 as the chemical compound form. Used for silicide gate formation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Target density and bonding method documentation; bonded targets may be parts
• ITAR/EAR screening for semiconductor equipment end-use
• Distinguish powder form from finished targets (potential 8473 parts)