Electroplating Grade Copper Sulfate from Japan
Refined copper sulfate used in acidic copper plating baths for electronics manufacturing. HTS 2833.25.00.00 for pure copper sulfates; purity optimized for uniform deposition. Excludes prepared plating solutions.
Duty Rate — Japan → United States
1.4%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Certify low chloride content (<10 ppm) via titration for electroplating suitability
• Ship in nitrogen-flushed bags to prevent oxidation; include plating performance specs
• TSCA notification required for chemical substances in commerce; track inventory limits