Sulfur Hexafluoride Semiconductor Processing Gas from Mexico
UHP SF6 for plasma etching in 300mm wafer fabrication (etchant for silicon dioxide). Electronically pure per Chapter notes under HTS 2812.90.0010.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Particle and moisture specs critical for acceptance
• Semiconductor supply chain reporting under CHIPS Act
• Special gas cabinets required for storage