Sulfur Hexafluoride Semiconductor Processing Gas from Japan
UHP SF6 for plasma etching in 300mm wafer fabrication (etchant for silicon dioxide). Electronically pure per Chapter notes under HTS 2812.90.0010.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Particle and moisture specs critical for acceptance
• Semiconductor supply chain reporting under CHIPS Act
• Special gas cabinets required for storage