Sulfur Hexafluoride Semiconductor Processing Gas from Japan
UHP SF6 for plasma etching in 300mm wafer fabrication (etchant for silicon dioxide). Electronically pure per Chapter notes under HTS 2812.90.0010.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Particle and moisture specs critical for acceptance
• Semiconductor supply chain reporting under CHIPS Act
• Special gas cabinets required for storage