2804.69.10.00/99.2% Pure Silicon Ingots for Electronics/Japan

99.2% Pure Silicon Ingots for Electronics from Japan

Cylindrical silicon ingots at 99.2% purity, produced via Czochralski method for slicing into semiconductor wafers. Falls under HTS 2804.69.10.00 as unworked elemental silicon with purity 99-99.99%, distinct from higher purity or doped forms. Used in chip fabrication after further refinement.

Duty Rate — Japan → United States

15.3%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Provide manufacturer's assay certificate specifying exact silicon percentage and impurity levels

• Ship in inert atmosphere packaging to prevent oxidation, which could affect purity claims

• Watch for reclassification if ingots exceed 100mm diameter and appear 'worked' per HTS terms