Argon for Semiconductor Manufacturing from Japan
Hyper-pure argon (6N purity) in tonner cylinders for sputter deposition and plasma etching in wafer fabrication cleanrooms. Falls precisely under HTS 2804.21.00.00 as elemental rare gas argon, unworked gaseous form.
Duty Rate — Japan → United States
13.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• ICP-MS certificates mandatory for purity claims; cleanroom packaging prevents contamination claims at entry
• Note ITAR restrictions if destined for defense semiconductors