Argon for Semiconductor Manufacturing from China
Hyper-pure argon (6N purity) in tonner cylinders for sputter deposition and plasma etching in wafer fabrication cleanrooms. Falls precisely under HTS 2804.21.00.00 as elemental rare gas argon, unworked gaseous form.
Duty Rate — China → United States
41.2%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• ICP-MS certificates mandatory for purity claims; cleanroom packaging prevents contamination claims at entry
• Note ITAR restrictions if destined for defense semiconductors