Sugar Wafers from Japan
Delicate, icing-sugar-dusted wafers ideal for tea time. HTS 1905.32.0049 covers these as 'other' wafers, prepared extensively from flours into thin, crisp forms per chapter notes.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Ensure sugar dusting is noted as 'otherwise prepared' to fit heading 1904 exclusion criteria
• Use HS explanatory notes on wafer thinness for binding rulings if challenged
• Check for starch content to avoid potato flour mix-ups under chapter 11