Multi-Wavelength Wafer Metrology Tool from United States
This multi-wavelength wafer metrology tool is a broadband spectrophotometry optical system that measures thin film stack thicknesses across entire semiconductor wafers. It is essential for process control in advanced semiconductor nodes. This instrument is classified under tariff item 9031.41.00 as an optical instrument for inspecting semiconductor wafers.
Duty Rate — United States → Canada
0%
Import Tips
• Document the broadband spectrophotometry technology and its specific use for thin film measurement on semiconductor wafers to support classification under 9031.41.00
• The CBSA may require evidence of multi-wavelength capabilities
• If the system includes a spectrometer or light source, verify whether these are integral parts for correct valuation