Camtek Eagle i 3D Wafer Metrology System from Mexico
An advanced packaging 3D metrology system combining optical profilometry and color interferometry for micro-bump inspection on semiconductor wafers. Critical for heterogeneous integration processes, this tool falls under 9031.41.00 as it inspects semiconductor wafers or devices.
Duty Rate — Mexico → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Classify under 9031.41.00 for optical inspection of semiconductor wafers
• Provide evidence of its use in semiconductor manufacturing to CBSA
• Consider duty relief if used in a certified manufacturing process