Camtek Eagle i 3D Wafer Metrology System from China
An advanced packaging 3D metrology tool combining optical profilometry and color interferometry for micro-bump inspection on semiconductor wafers. Critical for heterogeneous integration processes, this system inspects semiconductor wafers and falls under tariff item 9031.41.00.
Duty Rate — China → Canada
0%
Import Tips
• Ensure the tool is classified as an optical inspection instrument for semiconductor wafers
• Provide technical data sheets to CBSA for verification
• Work with a customs broker to streamline the import process