Advanced Packaging Wafer Inspector from Japan
An advanced packaging wafer inspector is an optical inspection system designed for fan-out wafer-level packaging (FOWLP) semiconductor wafers. It checks redistribution layers and underfill voids, making it essential for heterogeneous integration in advanced semiconductor packaging. This product is classified under tariff item 9031.41.00 as an optical inspection instrument for semiconductor wafers.
Duty Rate — Japan → Canada
0%
Import Tips
• Document the FOWLP-specific inspection functions and optical technology in your import declaration
• The CBSA may require technical evidence that the system is designed for semiconductor wafer inspection
• Consider whether any software or data analysis components might affect classification