High-Density Multilayer Smartphone Motherboard PCB from Mexico
An 8-layer high-density interconnect (HDI) PCB for smartphone motherboards, featuring microvias, blind/buried vias, and fine-pitch BGA pads. It is an advanced bare printed circuit board, falling under tariff item 8534.00.00.
Duty Rate — Mexico → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm the PCB is unpopulated and has no mounted processors or memory
• Provide detailed layer stack-up documentation for customs
• If the board includes embedded passive components, verify they are formed during the printing process to stay under 8534.00.00