9-Layer RF Front-End PCB for 5G Smartphones from Japan
A compact nine-layer HDI printed circuit board with a glass microcloth base, designed for smartphone RF modules handling mmWave signals. The non-flexible glass impregnation and dense conductor layers place it in heading 85.34 as a printed circuit.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify the PCB under 8534.00.00 as a printed circuit, separate from the smartphone
• Provide technical documentation on the glass base and HDI structure if requested by CBSA
• Verify eligibility for preferential tariff treatment under trade agreements