12-Layer High-Density Interconnect PCB for AI Accelerators from United States
An advanced HDI printed circuit with 12 layers of fine-line copper on glass epoxy base for GPU/TPU accelerator cards in AI computing. It is a non-flexible, glass-impregnated multilayer board, classified under 8534.00.00.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the PCB is unpopulated and has no mounted GPU or TPU
• Provide detailed layer stack-up and impedance control documentation
• If the board is sold with processors, it may be classified as a complete accelerator card