Bluetooth Audio Module Assembly
This assembly combines a printed circuit board with a Bluetooth chipset, amplifier IC, and passive components, designed solely for wireless headphones. It enables wireless audio reception and amplification, making it an essential part of the headphone apparatus.
Import Duty Rates by Country of Origin
| Origin Country | MFN Tariff | Surtaxes | Total Effective Rate |
|---|---|---|---|
| 🇨🇳China | Free | — | Free |
| 🇲🇽Mexico | Free | — | Free |
| 🇺🇸United States | Free | — | Free |
| 🇩🇪Germany | Free | — | Free |
| 🇯🇵Japan | Free | — | Free |
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If the module is a printed circuit assembly with active elements
Printed circuit assemblies are classified separately.
If the module performs a standalone communication function
Machines for the reception, conversion and transmission of voice or data fall under heading 85.17.
Not sure which classification is right?
The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Because this module contains a printed circuit with active elements, verify whether it qualifies as a printed circuit assembly under 8522.90.10
• If not, ensure it is solely for use with headphones of heading 85.19 or 85.21
• Prepare documentation showing the module's dedicated function
Related Products under Tariff item 8522.90.90
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