RF Plasma Asher for Photoresist Removal in PCB Fab from United States
An RF-powered plasma asher that uses dielectric loss to ash away photoresist materials from printed circuit boards after patterning. It is designed solely for semiconductor and PCB fabrication cleanrooms and falls under 8514.32.00 as a plasma furnace.
Duty Rate — United States → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Show the CBSA that the asher's function is heat treatment via dielectric loss, not just ashing
• Keep technical manuals available to demonstrate its exclusive use in PCB fabrication
• Check if the asher requires any environmental or safety approvals for RF emissions in Canada